APPARATUS AND METHOD FOR PERFORMING HEAT TREATMENT ON SEMICONDUCTOR WAFERS,申请号EP19880114763-传众专利搜索

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发明名称	APPARATUS AND METHOD FOR PERFORMING HEAT TREATMENT ON SEMICONDUCTOR WAFERS
摘要
申请公布号	EP0306967(A3)	申请公布日期	1990.08.22
申请号	EP19880114763	申请日期	1988.09.09
申请人	HITACHI, LTD.	发明人	HIRASAWA, SHIGEKI;TORII, TAKUJI;WATANABE, TOMOJI;KOMATSU, TOSHIHIRO;HONMA, KAZUO;SAKAI, AKIHIKO;TAKAGAKI, TETSUYA;UCHINO, TOSHIYUKI;NAGATOMO, HIROTO
分类号	H01L21/00;H01L21/673;H01L21/677;H01L21/687;(IPC1-7):H01L21/00	主分类号	H01L21/00
代理机构		代理人
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