| 摘要 |
PURPOSE:To save the amount of using noble metal and to avoid the influence of contaminants by coating selectively the noble metal only on necessary part for a bonding post or other bonding without contamination with Cl, Na and the like for bonding. CONSTITUTION:A plurality of leads 12 are arranged in space from an island 11 around the island 11. These leads 12 are connected to the outer frame of a lead frame, not shown, outsid the leads, and the island 11 is connectd through a bridge 13 to the outer frame of the lead frame. An Au film 14 is coated in a spot manner by deposition on the surfaces of the bonding post of the leads 12 and the island 11. As a result, the amount of using noble metal can be reduced, and contamination with substances such as Cl, Na and the like do not affect adverse influence to the semiconductor element. |
