| 摘要 |
PURPOSE:To improve adhesive strength of polyimide with circuit interconnections made of thin metal film by forming polyimide resin of 3,3',4,4'- biphenyltetracarboxylic dianhydride, 4,4'-diaminodiphenyl and p- phenylenediamine, and specifying the molar ratio of p-penylenediamine to 4,4'- diaminodiphenyl ether. CONSTITUTION:A first interconnection layer 3 is formed on an insulating board 2, and connected at a desired position to a second interconnection layer 6 to a polyimide resin layer 4 formed thereon via a through hole 5. The layer 6 is basically insulated from the layer 3 via the layer 4. A polyimide resin layer 7 is formed on the layer 6, and a third interconnection layer 9 is connected to the layer 6 at a desired position via a through hole 8. Polyimide resins 4, 7 are made of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4,4'-diaminodiphenyl ether and p-phenylenediamine. Molar ratio of the p-phenylenediamine to the 4,4'-diaminodiphenyl ether is 6:4-2:8. |
