发明名称 |
Resin-encapsulated semiconductor device |
摘要 |
The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.
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申请公布号 |
US4951122(A) |
申请公布日期 |
1990.08.21 |
申请号 |
US19880199538 |
申请日期 |
1988.05.27 |
申请人 |
HITACHI, LTD. |
发明人 |
TSUBOSAKI, KUNIHIRO;MURAKAMI, GEN;SAKUTA, TOSHIYUKI;ISHIHARA, MASAMICHI;ITO, SATORU;MORI, YASUO |
分类号 |
H01L23/31;H01L23/495;H01L23/498 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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