| 摘要 |
A module for insulatively housing and refrigerating a semiconductor device which is designed to be plugged into a printed circuit board within a conventional air-cooled electronic system. The plug-in module is designed such that the semiconductor device within the module can be operated at temperatures from -200 DEG C. down to the temperatures of liquid helium, while a short distance below the housing portion of the module the plug-in conductors connect to a connector on a conventionally cooled processor board. This is accomplished without frost or other type of troublesome moisture forming on the plug-in conductors.
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