FORMING OF THROUGH HOLE IN THICK FILM CIRCUIT SUBSTRATE,申请号JP19890030566-传众专利搜索

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发明名称	FORMING OF THROUGH HOLE IN THICK FILM CIRCUIT SUBSTRATE
摘要
申请公布号	JPH02209798(A)	申请公布日期	1990.08.21
申请号	JP19890030566	申请日期	1989.02.09
申请人	MATSUSHITA ELECTRIC IND CO LTD	发明人	KIKUCHI TAIJI;UCHIDA ITSURO;NOGUCHI HIROSHI;ARAI TATENOBU
分类号	H05K3/40	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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