| 摘要 |
PURPOSE:To enable the mass production of high accurate multilayer printed circuit boards well in productivity without making inner materials deviate from each other in position by a method wherein the inner materials are accurately positioned, outermost layers are provided thereon, the peripheral part of them is stitched up, and the stitched layers are hot-pressed to form a multilayered board. CONSTITUTION:A resin impregnated base material is interposed between two or more printed circuit boards of inner materials respectively on which a circuit pattern has been previously formed respectively, and two sides or four sides of the printed circuit boards of inner materials are fixed by stitching with a thread keeping the printed circuit boards of inner materials positionally aligned with each other accurately. Then, a resin impregnated material and a conductor foil and/or a laminated board are laid on both the sides of the printed circuit boards fixed by stitching, which is molded in multilayer by hot- pressing to obtain a multilayer printed circuit board. By this setup, a multilayer printed circuit board, which is very small in positional deviation between inner materials, easily obtained, and can be mass-produced excellent in productivity, can be realized. |
