| 摘要 |
PURPOSE:To effectively resitrict production of any crack in bumps and hence sharply improve reliability of a product by melting the bumps each formed on the board side and on the electronic component side, and thereafter lifting the electronic parts by lifting means to expand a distance between the bumps. CONSTITUTION:A pad 2 on the electronic component 1 side is positioned on a pad 12 on the board 11 side, and the electronic component 1 are moved in the direction of an indicated arrow to bring a bump 13 disposed on the pad 12 into contact with a bump 3 disposed on the pad 2 for heating. During the heating ultrasonic vibration 30 is applied to the board 11 to destroy an oxide film 20 for permitting the melted bumps 3 and 13 to fuse each other, whereby the electronic component 1 and the board 11 are coupled through the bumps 3 and 13. A magnet is allowed to act on a magnetic substance layer 8 of the electronic component 1 for which a packaging has been completed to left the electronic component 1 in the direction of an arrow and hence widen a distance G between the pad 2 on the electronic component 1 side and the pad 12 on the board 11 side for forming a columnar bump 23 and further drum-shaped bump 33. |
