发明名称 GAS INJECTOR AND APPARATUS FOR MANUFACTURING A WAFER HAVING THE SASME
摘要 A gas injector and a wafer processing apparatus having the same are provided to supply a process gas to a semiconductor wafer uniformly by spraying the process gas from side and lower surfaces of a second gas injection unit. A gas injector includes a first gas injection unit(110), plural second gas injection units(120), and plural gas lines(130). The first gas injection unit includes first holes(112) on overall side and lower surfaces and sprays process gas on a wafer. The second gas injection units are arranged to be apart from each other by a constant distance in a side direction of the first injection unit and include second holes(122) on half of the side and lower surfaces toward the first injection unit. The gas lines are connected to the first and second gas injection units, respectively and supply the process gas.
申请公布号 KR20070112496(A) 申请公布日期 2007.11.27
申请号 KR20060045458 申请日期 2006.05.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, TAE WOO;YIM, JANG BIN
分类号 H01L21/02;H01L21/20 主分类号 H01L21/02
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