| 摘要 |
PURPOSE:To reduce the thermal resistance of a layer between a semiconductor element and a part to be fixed, and improve the heat dissipating properties by a method wherein, in a conductive bonding layer fixing a semiconductor element on a part to be fixed, at least one kind of metal particle of copper, silver and aluminum having a grain diameter smaller than the thickness of the conductive bonding layer is mixed in solder whose main component is lead. CONSTITUTION:When a semiconductor device is manufactured, paste is printed on a retaining plate 1; a semiconductor element 2 is mounted on the paste layer, and subjected to heat treatment, thereby fixing the semiconductor element 2 on the retaining plate 1. As to the above paste, particle 5 of Cu and the like whose grain diameter is smaller than the thickness of a bonding layer 3 is mixed into paste type solder 4 containing high melting point solder of Pb and Sn. The thermal conductivity of the particle 5 is larger than the solder 4, so that the particle 5 acts as a thermal conduction route. As the result, the thermal resistance of the bonding layer 3 becomes smaller than the case where solder only is used, thereby improving heat dissipating properties. |
