| 摘要 |
<p>PURPOSE:To increase yield by calculating the center of a wafer by pattern recognition, correcting the error between said center and a carrier arm reference point, and making the center of the wafer and the center of a rotary processing part coincide with each other. CONSTITUTION:By an arm 28 fixed to a boss part 21 having retaining parts 24, 25, a wafer 21 is carried from the inside of a wafer carrier 22 to a positioning mechanism 31, via a vacuum chuck 29. By an up-and-down mechanism, the arm 28 mounts the wafer 21 on a positioning mechanism 31. This point becomes an original point, which is stored in the storage of a controller 40. The wafer 21 is set at the original point position of a positioning mechanism 31 and rotated to fix the position of an orientation flat. Next, a peripheral position point A of the wafer 21 is detected and the position is stored. By advancing from the point A, a point B is detected. By rectangularly advancing from the point B, a point C is detected, and the position is stored. Based on position data of the point A and data of the point C, the center position of the wafer 21 is detected, and the position is stored. Based on point position data and the center position data, the position of the wafer 21 is corrected. Thereby, highly reliable processing of a wafer is enabled, and the yield can be improved.</p> |
