发明名称 |
Method of forming electrically conducting layer. |
摘要 |
<p>A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of: (a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator; (b) applying the composition to the conducting surface to form a coated layer; (c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer, (d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and (e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).</p> |
申请公布号 |
EP0381900(A2) |
申请公布日期 |
1990.08.16 |
申请号 |
EP19890313682 |
申请日期 |
1989.12.28 |
申请人 |
SOMAR CORPORATION |
发明人 |
FUJII, RYUICHI;OGITANI, OSAMU 807, MITSUI-SENGENDAI HEIGHT;SHIROSE, TORU |
分类号 |
H05K3/46;G03F7/032;H05K1/00;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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