发明名称 |
BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD |
摘要 |
Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material. |
申请公布号 |
WO2008016140(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
WO2007JP65266 |
申请日期 |
2007.08.03 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;YAMAGUCHI, ATSUSHI;NISHIKAWA, KAZUHIRO;MIYAKAWA, HIDENORI |
发明人 |
YAMAGUCHI, ATSUSHI;NISHIKAWA, KAZUHIRO;MIYAKAWA, HIDENORI |
分类号 |
B23K35/26;B23K35/363;H01B1/22;H05K3/32;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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