Polyamide laminated on thermoplastic polyurethane.

摘要

A self-adhering laminate of a polyamide multi-polymer on thermoplastic polyurethane is prepared by disrupting the crystalline structure of the polyamide sufficiently through polymerization of at least 3 polyamide precursors such that a melting point in range of 140 DEG C to 190 DEG C is obtained. The laminate provides better resistance to solvents on the polyamide side than on the uncoated polyurethane. The bonding of the polyamide onto the polyurethane is achieved without the use of surface modifications, such as solvents, softening agents or adhesives.