Method and device for laser microsoldering

摘要

The invention relates to a method for describing, recognising and measuring a melting and wetting process for soft solders in the laser microsoldering of soldering contacts in electronic circuits, in which method the scattered-reflection characteristics, which change during the soldering process, of a solder surface irradiated with a visible light are measured during the wetting process and the values determined used to control the soldering laser. Designs and embodiments are described and schematically illustrated in the figures of the drawing. <IMAGE>