| 摘要 |
<p>PURPOSE:To prevent shrinkage due to thermal contraction of resin and to manufacture an IC card in which a whole circuit board mounted with electric components are sealed with resin by forming a frame with resin at a part not mounted with the component on the board and then resin-sealing a whole electronic module. CONSTITUTION:When a lower mold 10 is covered with an upper mold and resin is filled through a gate 10a, a frame 6 is formed on a part not mounted with electronic components 3 and a battery 4 on a circuit board 2. Resin is partly filled also on the rear face of the board 2 via a through hole 2a, and protrusions 6a are simultaneously formed. Eventually, an electronic module 9 formed with the frame 6 is set in another molds, and the whole periphery is sealed with sealing resin 7. In this case, since the frame 6 is previously formed on the board 2, the sealing resin can be wholly formed in a uniform thickness, and no shrinkage occurs due to thermal contraction to the components.</p> |
