CONTROLLING FLIP-CHIP TECHNIQUES FOR CONCURRENT BALL BONDS IN SEMICONDUCTOR DEVICES

摘要

A device has a first semiconductor chip (101) with contact pads in an interior first set (102) and a peripheral second set (103). A deformed sphere (104) of non-reflow metal is placed on each contact pad of the first and second sets. At least one additional deformed sphere (105) is placed on the first set pads, forming column-shaped spacers. The first chip is attached to a substrate (110) with a chip attachment location and a third set of contact pads (112) near the location. Low profile bond wires (130) span between the pads of the third set and the second set. A second semiconductor chip (140) of a size has a fourth set of contact pads (141 ) at location matching the first set pads and is placed over the first chip so that the fourth set pads are aligned with the spacers on the matching first set pads.