发明名称 |
Tape carrier for semiconductor chips |
摘要 |
A tape carrier (1) for semiconductor chips (4) including an insulating tape; a plurality of first conductor patterns (3) longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second leads connected with the other electrodes of the chip; a second conductor (5) shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern (6) formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern. |
申请公布号 |
US4949155(A) |
申请公布日期 |
1990.08.14 |
申请号 |
US19880219218 |
申请日期 |
1988.07.14 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
TAJIMA, NAOYUKI;TSUDA, TAKAAKI;CHIKAWA, YASUNORI |
分类号 |
H01L23/495;H05K1/02 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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