发明名称 Semiconductor IC device with polysilicon resistor
摘要 A semiconductor integrated circuit device includes: an active device, such as a bipolar transistor and a resistor formed of a first silicon layer formed on a thick insulating film on the semiconductor substrate. A metal silicide film is formed on the surface of said first silicon layer for connection between the first silicon layer and an interconnection layer. The interconnection layer has contact with a first and a second part of the metal silicide film formed on a opposited sides of an isulating film on first silicon layer. The part of the first silicon layer under the insulation film and between the first and second parts of the metal silicide film forms the resistor.
申请公布号 US4949153(A) 申请公布日期 1990.08.14
申请号 US19890362232 申请日期 1989.06.06
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HIRAO, TADASHI;SAKAUE, KIYOSHI;YAKUSHIJI, HISAO;OHSAKI, SABURO
分类号 H01L21/3205;H01L21/02;H01L21/822;H01L21/8222;H01L23/52;H01L27/04;H01L27/06 主分类号 H01L21/3205
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