发明名称 HIGH-MODULUS MOLDING PREPARED FROM DIACETYLENE COMPOUND
摘要 PURPOSE:To obtain the title molding of improved mechanical properties by polymerizing a diacetylene compound prepared by bonding a specified diacetylenic hydrocarbon group with a hydrocarbon group having a C-C double bond through an amide group and molding the polymer. CONSTITUTION:At least one diacetylenic hydrocarbon group of formula I (wherein R<1-2> are each a bivalent organic group such as -CH2-) is bonded with at least one hydrocarbon group having a C-C double bond through an amide group to obtain a diacetylene compound of formula II (wherein R<3-4> are each a monovalent organic group having a C-C double bond such as H2C=CH-; and X<1-2> are each an amide group) or formula III (wherein R<5> is a bivalent organic group having a C-C double bond such as -CH2CH=CH-) such as a compound of formula IV, V or VI, and this compound is polymerized into a polymer. This, polymer is molded alone or together with various molding aids, etc., and irradiated with a radiation such as X-rays or gamma-rays at a dose of 5-500MRad at 10-150 deg.C to obtain a molding of a modulus >=18.5Pa in at least one direction.
申请公布号 JPH02202923(A) 申请公布日期 1990.08.13
申请号 JP19890022597 申请日期 1989.02.02
申请人 ASAHI CHEM IND CO LTD 发明人 KATO JINICHIRO;NAKAMURA KATSUYUKI
分类号 C08J5/00;C08F38/00;C08G69/00;C08J3/28;C08J7/18 主分类号 C08J5/00
代理机构 代理人
主权项
地址