| 摘要 |
<p>PURPOSE:To reduce noise from a multilayered printed board by making distances between an element and power supply layers shorter so as to reduce inductance components and, at the same time, forming an insulating layer of a thin film section so as to reduce conductor intervals between the pairs of power supply layers. CONSTITUTION:A multilayered wiring board 10 composed of a thin film section 11 and thick film section 12 is formed against an integrated circuit element 1. Power supply layers 111 and 112 are arranged in the section 11 adjacent to the main surface side of the section 11 and power supply layers 121 and 122 are provided in the section 12. In addition, through holes for power supply 20 and signals 30 are provided. In order to reduce inductance components by making the distances between the element 1 and power supply layers shorter, the power supply layer pairs 111 and 112 and 121 and 122 are formed adjacent to an element 1 mounting surface by means of the section 11 and, at the same time, an insulating layer is formed of the section 11. Therefore, conductor intervals between the power supply layer pairs can be reduced extensively and the coupling between the power supply layers can be strengthened, resulting in an increase in electrostatic capacity. Thus noise can be reduced from the multilayered printed board.</p> |
