COPPER FOIL AND SURFACE TREATMENT THEREOF

摘要

A copper foil laminated structure is provided to improve reliability of electronic equipment by applying a silane coupling agent onto a surface of a copper foil, thereby maximizing a synergistic effect by using the silane coupling agent without affecting characteristics(basicity or acidity) of reactive sites of a surface of an insulating material layer that is subsequently laminated on a top face of the copper foil, and a copper foil surface treatment method is provided. A copper foil laminated structure comprises: a copper foil; and an adhesive force improving layer applied onto a surface of the copper foil, the adhesive force improving layer being formed using a silane coupling agent mixture of a silane coupling agent with an amino functional group and a silane coupling agent with a glycidoxy functional group. The copper foil laminated structure further comprises an anti-rust treatment layer formed between the copper foil and the adhesive force improving layer. A copper foil laminated structure comprises: a copper foil(1); a nodule layer formed on a surface of the copper foil; a barrier plating layer(2) surrounding the nodule layer; and an adhesive force improving layer(3) applied onto a top face of the barrier plating layer, the adhesive force improving layer being formed using a silane coupling agent mixture of a silane coupling agent with an amino functional group and a silane coupling agent with a glycidoxy functional group. The copper foil laminated structure further comprises an anti-rust treatment layer formed between the barrier plating layer and the adhesive force improving layer.