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发明名称
SOLDERING OF DOUBLE-SIDED PACKAGING CIRCUIT BOARD
摘要
申请公布号
JPH02201997(A)
申请公布日期
1990.08.10
申请号
JP19890019747
申请日期
1989.01.31
申请人
TAIYO YUDEN CO LTD
发明人
SATO SATOYUKI;OAKU TADAHIKO
分类号
B23K1/00;H05K3/34
主分类号
B23K1/00
代理机构
代理人
主权项
地址
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