| 摘要 |
PURPOSE:To prevent cut in step by placing on one plane circuit elements with their front faces facing downwards and fixing the gaps between those elements with an insulative adhesive and bonding a substrate to the back faces of those elements and providing mutual wires on the front faces of those elements. CONSTITUTION:Semiconductor pellets 3A and 3B are sucked 6 with their front faces facing downward, and fluid epoxy resin adhesive 4 is filled in the gaps between the pellets and the resin is made to harden. Then the suction is released and the rear faces of the pellets is bonded 2 on the substrate 1. Then a resist mask is applied to remove the bulged adhesive 4 by etching. Next, a metal is vacuum-evaporated on the front faces for a wiring 5 by etchibg. With this constitution no step is formed between the pellets and cut in the wiring does not occur. |
