发明名称 HEAT RESISTANT BRIDGE-FORMED WIRE
摘要 PURPOSE:To obtain a low-cost heat resistant bridge-formed wires by having thermoplastic resin with aromatization or heterocycles in molecules made into an insulating layer and bridged by radiating ion beams with great energy. CONSTITUTION:It is impossible to bridge polymer with aromatization or heterocycles in molecules if electronic beams are radiated, however it is possible if ion beams are radiated. The reason why it can be bridged by radiating the ion beams is that the radiation of the ion beams is much greater (few thousands times) in energy given to per unit volume than that of the electronic beams and that the opening of benzene rings and heterocyclic rings, not caused by the electronic beams, is caused by the ion beams. It is suitable that the energy of the ion beams is within 0.1MeV and 50MeV, and the radiated amount of the ion beams is 1X10<11>/cm<2> to 1X10<15>/cm<2>. Thus, a relatively low cost resin is used to obtain the heat resistant bridge-formed wires excellent in thermal transformation property.
申请公布号 JPH02199722(A) 申请公布日期 1990.08.08
申请号 JP19890018600 申请日期 1989.01.27
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SHIYUKUJIMA SATOSHI
分类号 H01B13/14;H01B3/30;H01B7/29 主分类号 H01B13/14
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