| 摘要 |
<p>The present invention concerns a method for washing off flux residues subsequent to soldering from a circuit board or equivalent component. The circuit board washing procedures of prior art have either been detrimental to the environment or poor in their washing result. These problems have in the present invention been solved by including at least one step in the procedure in which steam is sprayed on the circuit board or equivalent. The steam spraying step is advantageously combined with preceding water washing and rinsing steps. A circuit board or equivalent component rinsed with hot steam is recovered in a cleaner condition than before, and moreover, entirely dry.</p> |
