| 摘要 |
<p>PURPOSE:To enhance the strength against deformation by setting the bending neutral surface of a substrate to a position where stress is hardly applied to an electronic paper by mutually differentiating the shearing elastic moduli of the fixing medium layers formed to both surfaces of the substrate. CONSTITUTION:The shearing elastic moduli of fixing medium layers 11, 13 fixing an outer plate 6 and a spacer 7 to the upper surface 4a of a substrate 4 and the bottom surface 4b thereof are differentiated and the bending neutral surface H2 of the substrate 4 is set to the position separated by a distance D2 from the bottom surface 1a of an electronic part 1. Since the stress applied to the bottom surface 1a of the electronic part 1 is smaller as the distance from the bottom surface 1a of the electronic part 1 to the bending neutral surface of the substrate becomes shorter, the breakage of the electronic part 1 is prevented. The thickness center of the electronic part 1 is most desirable as the position of the neutral surface H2. In order to reduce the stress to the electronic part 1 due to bending movement A, the shearing elastic modulus of the fixing medium layer 11 may be lowered with respect to the other fixing medium layer 13. Therefore, the fixing medium layer 11 may be constituted by partially applying a fixing medium 15 and, in a thickness differentiating method, the fixing medium layer 11 may be made thicker than the other fixing medium layer 13.</p> |
