发明名称 METHOD FOR MANUFACTURING PROBE CARD
摘要 A method for manufacturing a probe card is provided to improve productivity and yield by bonding a plurality of micro probes to a plurality of connecting terminals formed on the probe board at the same time. A plurality of micro probes(300) are manufactured. A probe board(200) having a plurality of connection terminals(210) is manufactured. A solder cream is coated in a plurality of connection terminals of the probe board. The plurality of micro probes are arranged for the plurality of connection terminals of the probe board coated with the solder cream. The solder cream is melted and cooled by applying an ultrasonic wave or heating and the plurality of micro probes are bonded with the plurality of connection terminals. Before applying the ultrasonic wave, the probe board is preheated.
申请公布号 KR20090040647(A) 申请公布日期 2009.04.27
申请号 KR20070106103 申请日期 2007.10.22
申请人 SECRON CO., LTD. 发明人 KIM, YOUNG JIN;SHIM, YOUNG DAE
分类号 H01L21/66;G01R1/06 主分类号 H01L21/66
代理机构 代理人
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