| 摘要 |
A plate-like body (e.g., a silicon wafer) at least about 0.5 mm thick that is to be thinned is reinforced by applying to one main surface, in adhesive relationship thereto, a coating of a finely divided material which is fused to form a hard mechanically supportive coating. The body is thinned from the second main surface to a thickness less than about 250 mu m. For a silicon body, the mechanically supportive coating comprises at least about 18% silicon.
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