| 摘要 |
<p>PURPOSE:To mount an IC module almost horizontally by forming the first recessed part having a depth almost equal to the thickness of the IC module to a card base material and embedding the IC module in the first recessed part and forming the second recessed part to the bottom surface of the first recessed part. CONSTITUTION:The first recessed part 5 for embedding an IC module 2 is provided to a card base material 1 and the depth dimension of the first recessed part 5 is made almost equal to the thickness dimension of the IC module 2. The second square recessed part 6 for storing an adhesive flowing out at the time of pressing in order to adhere the card base material 1 and the IC module 2 is provided to the bottom surface of the first recessed part 5. Grooves 7 reduce the support area of the first recessed part 5 so as to bond the IC module 2 to the first recessed part 5 against the thickness of the adhesive under pressure by force as small as possible when said IC module 2 is bonded to the first recessed part under pressure and makes the adhesive easy to flow in the second recessed part 6 when the IC module 2 is adhered. The IC module 2 can be easily mounted to the bottom surfaces of the recessed parts horizontally and the difference in level between the surface of the card base material 1 and the IC module 2 can be reduced.</p> |
