发明名称 |
Electric carrier devices and methods of manufacture |
摘要 |
New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.
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申请公布号 |
US4946733(A) |
申请公布日期 |
1990.08.07 |
申请号 |
US19880222435 |
申请日期 |
1988.07.21 |
申请人 |
AMOCO CORPORATION |
发明人 |
SEEGER, JR., RICHARD E.;MORGAN, NOREDIN H.;LANDRY, JR., JOSEPH R. |
分类号 |
H01B1/22;H01L23/13;H01L23/14;H01L23/498;H05K3/24 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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