发明名称 STRUCTURE FOR A LATCHUP ROBUST GATE ARRAY USING THROUGH WAFER VIA
摘要 A structure, method and a design structure for preventing latchup in a gate array. The design structure including: a NFET gate array and a PFET gate array in a substrate; an electrically conductive through via extending from a bottom surface of the substrate toward a top surface of the substrate the NFET gate array and PFET gate array, the through via electrically contacting the P-well.
申请公布号 US2009152593(A1) 申请公布日期 2009.06.18
申请号 US20080043212 申请日期 2008.03.06
申请人 CHAPMAN PHILLIP FRANCIS;COLLINS DAVID S;VOLDMAN STEVEN H 发明人 CHAPMAN PHILLIP FRANCIS;COLLINS DAVID S.;VOLDMAN STEVEN H.
分类号 H01L27/02 主分类号 H01L27/02
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