发明名称 |
Submount for semiconductor laser element |
摘要 |
A submount for a semiconductor laser element includes a substrate and a barrier layer disposed on opposed surfaces of the substrate and including a plurality of layers wherein the outermost layer of the barrier layers is Au and Ag. A metal alloy solder layer comprising Sn, Ag, and Sb is deposited on the barrier layers.
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申请公布号 |
US4947238(A) |
申请公布日期 |
1990.08.07 |
申请号 |
US19890345163 |
申请日期 |
1989.05.01 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ISHII, MITSUO;NAGAI, SEIICHI;HASEGAWA, KAZUYOSHI;TANAKA, TOSHIO |
分类号 |
H01S5/00;H01S5/02 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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