发明名称 Submount for semiconductor laser element
摘要 A submount for a semiconductor laser element includes a substrate and a barrier layer disposed on opposed surfaces of the substrate and including a plurality of layers wherein the outermost layer of the barrier layers is Au and Ag. A metal alloy solder layer comprising Sn, Ag, and Sb is deposited on the barrier layers.
申请公布号 US4947238(A) 申请公布日期 1990.08.07
申请号 US19890345163 申请日期 1989.05.01
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 ISHII, MITSUO;NAGAI, SEIICHI;HASEGAWA, KAZUYOSHI;TANAKA, TOSHIO
分类号 H01S5/00;H01S5/02 主分类号 H01S5/00
代理机构 代理人
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