Lead frame assembly for integrated circuits having improved heat sinking capabilities and method

摘要

An integrated circuit package is described that provides increased heat dissipation of heat generated in an integrated circuit chip that can be positioned within the package. This increased heat dissipation characteristic is achieved by configuring enlarged metal areas of the lead frame of the package that are extensions of the flag area. The flag area is the portion of the lead frame to which the integrated circuit chip is mounted in the assembly of the semiconductor package. The increased lead frame area provides increased contact with the package housing and provides a thermal conduction path in close proximity to the exterior surface of the package housing. The integrated circuit chip has a more efficient thermal path to the ambient air thermal heat sink.