METHOD AND DEVICE FOR PACKING PROCESSOR

摘要

PURPOSE:To improve the information transfer ability between processors by connecting a 1st chip which processes the information and a 2nd chip which emits and receives the light to an optical fiber to pack these chips and using the optical communication. CONSTITUTION:A photodetector 10 converts the optical signal received via a terminal 11 into an electric signal flowing to the photodetector 10. This electric signal is transmitted to a silicone chip 1 as it is via a buffer 9 and a through hole 8. A light emitting element 14 converts the electric signal received via a buffer 13 and a through hole 12 into an optical signal and outputs it to a light emitting terminal 15. The optical signal received from the terminal 15 is sent to the outside via an optical fiber 5. The hole 12 is connected to the chip 1 to transmit the electric signal received from the chip 1 to the element 14. Thus the information transfer ability is improved between processors with application of the optical communication.