| 摘要 |
PURPOSE:To realize easy handling during assembly, etc., and to enable compensation for variability of dimensional tolerance of components of integrated circuit elements and of height and inclination during their assembly by laminating a soft and easily deformable silicone resin layer in one sheet on a layer of silicone resin having a strength necessary for handling. CONSTITUTION:A heat transfer sheet 3 is formed in one sheet by silicone resin wherein a heat transfer material such as metal oxide is mixed. The heat transfer sheet 3 is constituted in one sheet by laminating a layer 2 of soft and easily deformable silicone resin on the layer 1 of silicone resin having a strength required for handling. For example, an extremely soft material called silicone gel is used as a silicone resin of a base material for a deformation layer 2. And, for example, when the heat transfer sheet 3 is used for a cooling structure of an integrated circuit element, a cold plate 6 having a coolant flow path 7 inside is provided opposite to a plurality of integrated circuit elements 4 which are mounted on a printed board 5. The heat transfer sheet 3 is held and used between the integrated circuit element 4 and the cold plate 6. |
