| 摘要 |
PURPOSE:To eliminate a fear for disconnection and short-circuit of lead frame in the substrate supporting side by holding the end surface of substrate support in the opposite side of exernal lead with a couple of or more pairs of tapered portions of protruded holding portion is such a way as floating the substrate support within the metal dies. CONSTITUTION:A lead frame providing one or more common fine leads 41, a plurality of external leads 36 extending in the same direction from such common fine lead 41 and a substrate support 32 which also works as a heat sink coupled to the one end portion of such external leads 36 is prepared. A semiconductor pellet 31 is fixed on said substrate support 32 and the semiconductor pellet 31 and external lead 36 are electrically connected with a predetermined means. Thereafter, the end surface of substrate support 32 at the opposite side of external lead 36 is held with the tapered portions of one or more couples of protruded holding portions 39 so that the resin 35 can be supplied in the predetermined thickness to the upper and lower surfaces of substrate support 32 and the substrate support 32 can be floated within the metal dies 37, 38. Moreover, the esternal lead 36 is held by the metal dies 37, 38 for resin sealing. |
