| 摘要 |
PURPOSE:To obtain the inductance elements of extremely small size and low price and to form the elements in an arbitrary position of an insulating substrate continuously by forming the elements on the insulating substrate directly by use of a supersonic bonding device of insulating wires. CONSTITUTION:After a copper foil is stuck to the overall surface of one of the main planes of an insulating substrate 1, the copper foil is etched selectively to form the conductive paths of desired pattern. A winding frame body 3 is placed and fixed on the insulating substrate 1 with being close to the conductive paths by an adhesive 4. The winding frame body 3 has a function of winding the wire for forming an inductance element. One end of a wire 5 is supersonic- bonded on one of the conductive paths 2 by use of a supersonic bonding device. The insulating wire 5 is wound on the winding frame body 3 by providing a capillary chip 9 around the body 3. During this process, the insulating wire 5 is wound on the body 3 only by the predetermined number of tuns in one direction into a coil from thereby obtaining the inductance element of desired value. |
