| 摘要 |
PURPOSE:To enable the cap to be directly connected to the wiring substrate and the heat dissipation to be performed effectively by applying a heat-resistant metallizing printing to green sheets made of a ceramic powder and an organic binder, integrating them by heating and pressing them, and metallizing a through-hole. CONSTITUTION:After green sheets 1'-1<4>' made of a ceramic powder and an organic binder is applied with a heat-resistant metallizing printing using patterns 5-8, holes 5'-7' are made, they are integrated by heating and pressing them, and a through-hole is made and metallized, providing a through-hole metallization 9. An LSI chip 10 is connected to a metallization 5 by an eutectic alloy through a gold plating, the pad of the chip 10 and a metallization 6 are bonded by a gold wire 11, and sealing is made by a cover 12 having a thermal expansion coefficient similar to that of ceramics. An electrode 8 is placed so as to be opposed to an electrode 14 of a wiring substrate 15 and is connected by the use of a wax material 13, and a radiating fin 16 is attached to the rear of the ceramic chip carrier. |
