ALIGNMENT DEVICE FOR ELECTRONIC COMPONENTS

摘要

An alignment device (16) for connecting an electronic component package (14) to a printed circuit board (18) comprises an electrically insulating body having a plurality of holes (36) therethrough to receive the pin connectors (26) of the component and align them with pre-formed holes (28) in the board. A heat sink (12) is releasably engaged in slots (40) in tabs (38) projecting from the device (16) and is also releasably engaged with lugs (20) which pass through slots (30) in the device (16) and are secured in holes (22) in the board. The component (14) is secured to the heat sink (12) by a rivet (24). Numerous modified embodiments are described in the specification.