| 摘要 |
PURPOSE: To eliminate the positional deviation of a circuit containing sheet and to obtain high adhesion between circuit-containing sheets by sticking the sheets to each other with tetrafluoroethylene polymer separating layers in between. CONSTITUTION: A circuit layer A composed of planar wiring of a conductive material arranged in a desired circuit pattern is supported between a pair of supporting sheet members B. The members B are made of polytetrafluoroethylene or polytetrafluoroethylene containing fibrous stiffening agent. Between each paired members B, a tetrafluoroethylene polymer adhesive layer C is inserted. The adhesive seals the circuit-containing layer, electrically separates an adjacent circuit composed of a circuit-bearing member, and sticks the circuit-containing member. Therefore, a multilayer circuit board which seldom causes the positional deviation of the circuit layers and has high adhesion and excellent circuit sealing and separating properties can be obtained. |
