| 摘要 |
The card has a printed wiring board carrying various components including LSI memory chips (6,6'). These chips are stacked one above the other separated by insulation. Each chip has its own contact pads (13,13') on its top surface and corresponding contact points in the printed wiring (16-18) on the board's top surface. Contact pads on different chips capable of sharing the same printed wire are connected by conducting leads (12,12') to that shared wire (16). Those pads (13,13') not capable of so sharing are connected by separate conducting leads (15,15') to respective separate printed wires (17,18). The leads are supported by insulating films (20). The separate leads may branch or fork in the plane of their chip; one fork terminating and the other continuing down to the board. |
