METHOD OF MANUFACTURING A HOUSING FOR A MICROELECTRONIC DEVICE WITH CONTACT PADS, AND ITS USE IN CARDS CONTAINING COMPONENTS

摘要

A micromodule or chip carrier package for chip containing components has an insulating support base for carrying a series of flush-mounted contact areas. A semiconductor circuit or chip is placed on one of the contact areas and the chip is connected to the other contact areas by means of wires. A hollow case is mounted over the assembly and has a bore for receiving a drop of resin which has the function of protecting the semiconductor circuit or chip.