| 摘要 |
A device for correcting warp of printed circuit boards (3) in a carrierless soldering apparatus (1) wherein the printed circuit boards (3) are soldered while being held by holding claws (5) of a conveying means (6) is disclosed, which comprises a sliding means (27) involving a single or plural warp-correcting means (9), sliding plates (20) for installing the warp-correcting means (9) thereon, and a single or plural pairs of slide beds (21) provided in parallel to the direction of movement of the printed circuit boards (3), and a driving means (28) for reciprocating the slide means (27) in parallel to the direction of movement of the printed circuit boards (3). |
