| 摘要 |
Connection leads (32, 35) of a semiconductor device extending from a chip carrier housing (31) for connection with external circuitry are arranged in a plurality of rings, one within the other. The leads (32), in the outermost ring, are composed of surface connection leads to be electrically connected to the uppermost layer (41) only of a multilayer printed circuit board (40) and the connecting leads in the inner ring or rings are composed of lead pins (35) to be inserted into and be electrically connected to plated through holes (35) of the multilayer printed circuit board (40) for connection to other layers (43) of the board (40). |
