| 摘要 |
<p>PURPOSE:To obtain a printed-circuit board where soldering short-circuiting between pads is hard to occur by laminating an inner pattern consisting of improved thermal conductivity within a printed-circuit board which is provided with an electronic parts and a pad to be soldered and by placing a comb-tooth part provided at this inner-layer pattern at the root of the pads between the pads. CONSTITUTION:A pattern 4 which is insulated from a pad 3 is laminated directly below the pad 3 so that the solder short-circuiting part at the tip of the pad 3 may not move to the root and this inner-layer pattern 4 is in a shape having a comb-tooth part 4a. Then. the cut-out part is brought directly below the pad 3 and it is formed so that the comb-tooth part 4a of the inner-layer pattern between the pads 3 is located at the root part between the pads 3.</p> |
