| 摘要 |
<p>PURPOSE:To obtain the molding material for sealing having excellent wetproof property by adding a specified organic silicon compound to an epoxy resin molding material, material preserving property thereof is improved. CONSTITUTION:There are bisphenol A type epoxy resin, novolac type epoxy resin, etc. as epoxy resin, an amine group curing agent, fatty polyamine, etc. as a curing agent and glass fiber, metallic whisker, etc. as fillers. A substance obtained by adding the organic silicon compound shown in a constitutional formula to stearic acid, zinc stearate, etc. is used as additives, 0.01-3% is preferable as the quantity, the effect of improvement of wetproof property is small when said quantity is little, and adhesive property with metals lowers when said quantity is much. Rs In the constitutional formula show dydrogen proups, methyl groups or phenyl groups, but it is prefereable that partial Rs are denatured by dydroxyl groups, amine groups or epoxy groups.</p> |
