| 摘要 |
<p>PURPOSE:To improve mechanical strength, adhesive property with metals and wetproof property by adding a specified organic silicon compound to an unsaturated polyester resin molding material consisting of unsaturated polyester resin, a cross-linking agent, fillers and an addition agent. CONSTITUTION:The molding material for sealing the electronic part is manufactured in such a manner that a monomer with unsaturated groups, which react with unsaturated polyester resin such as styrene, is added to unsaturated polyester resin obtained by reacting a saturated dibasic acid, such as isophthalic acid, orthophthalic acid, etc. and an unsaturated dibasic acid, such as ethylene glycol, dipropylene glycol, etc. as the cross-linking agent. The fillers such as glass fiber are added, and the organic silicon compound shown in the constitutional formula is added to the additives such as stearic acid by 0.01-3% quantity. Rs in the formula are hydrogen groups, methyl groups or phenyl groups, and it is preferable that partial Rs are denatured by hydroxyl groups or amino groups.</p> |
