发明名称 MULTILAYER WIRING BOARD
摘要 PURPOSE:To obtain an insulating layer having a flat and smooth surface by a method wherein the insulating layer obtainable by adding an acrylic leveling agent to an epoxy insulating resin is provided. CONSTITUTION:An internal layer circuit 2 is formed on the surface of an insulating substrate 1. A primer layer 3 is applied on the surface of this substrate 1 and an insulating layer 4 is applied on the surface of the layer 3. The layer 4 is a coat of epoxy resin with an addition of 0.2wt.% or more of an acrylic leveling agent. Thereby the smoothness of the surface of a multilayer wiring board 10 is improved and the improper short-circuit of an external layer circuit 8 can be reduced.
申请公布号 JPH02194695(A) 申请公布日期 1990.08.01
申请号 JP19890014363 申请日期 1989.01.24
申请人 HITACHI CONDENSER CO LTD 发明人 NAKAMURA YASUHIRO;YOKOYAMA HIROYOSHI;ISODA SATOSHI;NIIJIMA MOTOI;TAKEDA TOKISADA
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址