| 发明名称 |
METHOD OF IMPROVING THE BOND STRENGTH OF ELECTROLESSLY DEPOSITED METAL LAYERS ON PLASTIC- MATERIAL SURFACES |
| 摘要 |
<p>Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization. The metal deposits produced are notable for good bond strength.</p> |
| 申请公布号 |
CA1272079(A) |
申请公布日期 |
1990.07.31 |
| 申请号 |
CA19870543064 |
申请日期 |
1987.07.27 |
| 申请人 |
BAYER AKTIENGESELLSCHAFT |
发明人 |
GIESECKE, HENNING;WOLF, GERHARD D.;PROBST, JOACHIM;SCHUSTER, KLAUS |
| 分类号 |
C23C18/20;C23C18/28;H05K3/18;H05K3/38;(IPC1-7):C23C18/28;C23C18/30 |
主分类号 |
C23C18/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
